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Custom Air Cooled Heatsinks

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    Air cooled heatsinks suitable for Power Semiconductors such as IGBTs and hockey puck style components as well as baseplate cooled Power Resistors.

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    Designs can utilize a range of materials and fabrication styles such as bonded fin, soldered fin and high density extrusions in aluminium.

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    Combining air cooled heatsinks with other technologies such as Heatpipes, heat spreaders and exchangers can vastly decrease the thermal resistance increasing the overall performance of the plate. This will allow heat to be transferred away from semiconductor junctions more effectively increasing lifetime of your critical components.

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    Efficient cooling solutions for press pack hockey puck devices with the inclusion of nickel plated copper fins.

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Telephone +44 (0)1793 784389 or email: sales@ppm.co.uk