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Vincotech ready to ship new PIM and sixpack power modules with IGBT M7 chips

Vincotech have announced they are ready to ship the new flowPIM & flowPACK E1/E2 modules which use IGBT M7 chip technology. The PIM (CIB) range – which integrates a three-phase rectifier, brake and three-phase inverter in a single package – now extends up to 50A and the sixpack configuration up to 100A. These modules deliver superior thermal performance and enhanced efficiency while at the same time reducing supply chain issues due to Vincotech’s multiple sourcing right down to the chip level.

Benefits

  • 20 % better thermal performance for extended life, more power and greater reliability
  • Smaller packages such as the 25 A PIM in flow E1 for higher power density
  • Real multiple source down to chip level for enhanced supply chain security
  • Easy assembly with pre-applied phase-change material and Press-fit pins

Key housing features

  • 12 mm standard industrial package
  • Pre-bent DCB for excellent thermal contact
  • CTI 600 housing material
  • Press-fit pins with stress-relive zone
  • Optional Phase-change material

Key electrical features:

  • Lowest on-stage voltage Vce(sat)
  • Optimized dynamic losses
  • Improved FWD softness
  • Enhanced dV/dt controllability

Output power v competitor equivalent

The chart above compares the output power of a flowPIM E2 1200 V/25 A module with a competitor’s equivalent. The test was conducted at the maximum allowed Tj temperature of 150°C and covers switching frequencies from 2 to 16 kHz. The new flowPIM E2 module outperforms the competition by delivering up to 15% higher output power. (fout=50Hz, Tsink=80°C, Vout=340 V)

Product range – flow E with IGBT M7

Useful links

 

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Telephone +44 (0)1793 784389 or email: sales@ppm.co.uk